Model No : PMP-P-300 series
PMP-P-300A, PMP-P-300B, PMP-P-300C, PMP-P-300C-J, PMP-P-300CY, PMP-P-300CG
PMP-P-300US-1, -2, -3, PMP-P-300US-1A, PMP-P-300US-4
Properties : High thermal conductivity, good shock absorption and gap filing capacity.
Application : Use for the heat transfer between transistor and PCB, metal frame and heat sink. P-300 is used as heat conductive solution widely in the TFT, PDP, power supply and the ODD module of game console.
PMP-P-300 SOFT THERMAL CONDUCTIVE SILICONE
(Below 1 mm.) or too long (Above 20
mm.), add PMP-P-400 can prevent
deformation when install PMP-P-300CY
Note : If the size of PMP-P-300CY is too thin (Below 1 mm.) or too long (Above 20 mm.), add PMP-P-400 can prevent deformation when install PMP-P-300CY
Application : Use for high compression rate application, will not damage IC chip or impact the flatness of metal plate housing
